The Intel Rocket Lake processors feature higher clock speeds and new architecture, this means that the temperatures can directly be affected by the updated design. In terms of packaging, the CPUs ship with the same STIM or Soldered Thermal Interface Material as the 9th Gen Unlocked chips.
In short, Intel has gone back to the soldered design with higher quality thermal interface material between the die and IHS so that should technically lead to better temperatures under overclocking and stress situations. The results were carried out with the ASUS Ryujin 240 AIO liquid cooler:
